Component analysis

Inspection of electronic components


Zebicon offers analysis of electronics and assembled parts to document interaction between elements, solderings, integrated circuits, short circuits etc. The analysis is typically used for confirming or disconfirming source of errors, and for checking if components are located appropriately after assembly.

This type of analysis is conducted using CT scanning. The process is non-destructive, hence, it is possible to document details without destroying or dismantling the part. Zebicon's CT scanner from GOM scans parts up to Ø240 mm x H. 400 mm in high resolution. 

Documentation inside out
As CT scanning is X-ray technology, both inside and outside geometry is documented, and hidden details can be analysed. 

Component analysis can be used for:  

  • Inspection of PCB tracks, contact points and connections
  • Check of solderings and short circuits
  • Inspection of interaction between elements 

Images, video slide or interactive 3D model
The result of a component analysis from Zebicon is typically a series of images, combined with a video slide show, presenting the scanned part layer by layer in a given plane.

Moreover, data is available for the free softwares myVGL and GOM Inspect, which opens up for more analysis and inspection.

CASE - Headset

GN Netcom A/S wanted knowledge about the interaction between internal elements in a headset.

Using CT scanning, Zebicon delivered 2D x-ray images to document the internal elements.

Read the case