Digital Image Correlation (DIC)

Optical 3D deformation analysis


Digital image correlation, or optical 3D deformation analysis, is an alternative to the traditional strain gauge technique, where mechanical deformation is converted to electrical resistance.


When performing digital image correlation (DIC), two cameras record the object during load, and afterwards stress, strain, and displacements are calculated by advanced software. Paint is sprayed on the object in a stochastic pattern, and the cameras detect the change in the pattern during load. 


Non-tactile technology

The technology is non-tactile and replaces a number of traditional measuring techniques. Optical 3D deformation analysis is used for: 

  • Determination of material charactistics (Youngs module, FLC etc.)
  • Component analysis (vibrations, durability etc.)
  • Verification of Finite Element Analysis

Zebicon does not offer services within DIC, but is a distributor of the metrology system ARAMIS for digital image correlation.

Contact

Jeppe H. Laursen
CEO

+45 4196 4955
jhl@zebicon.com